Silica Powder (Silicon Micropowder)
Silica powder (silicon micropowder) is finely milled crystalline or fused quartz used as a filler in epoxy molding compounds (EMC) for semiconductor packaging, electronic underfill, and high-frequency PCB substrates. Spherical silica grades dominate advanced packaging.
Key Properties at a Glance
| Crystal Form | Crystalline (angular) / Fused (angular) / Spherical (fused & re-melted) |
|---|---|
| Median Particle Size | 1 – 30 μm |
| Maximum Particle Size | ≤45 – ≤75 μm (Top-cut) |
| SiO₂ Content | ≥99.5% (electronic) / ≥99.9% (semiconductor) |
| Radioactive U+Th | ≤1 ppb (semiconductor / advanced packaging) |
| Thermal Expansion | 0.5 × 10⁻⁶ /°C (fused) vs 14 × 10⁻⁶ /°C (crystalline α-quartz) |
Range shown is category-wide; refer to individual grade COA for precise specs.
Product pages are being prepared and will be published shortly.