Silica Sol

Silica sol is a colloidal dispersion of nano-sized amorphous silica particles (4-100 nm) in water, used as a binder for precision investment casting, refractory coatings, photovoltaic wafer polishing, and catalyst supports.

Key Properties at a Glance

Particle Size	4 – 100 nm
SiO₂ Content	20 – 50 wt%
pH	8.5 – 10.5 (alkaline) / 2 – 4 (acidic)
Density	1.13 – 1.40 g/cm³
Viscosity	<10 cP @ 25 °C
Stabilizer	Na₂O / NH₃ / Al₂O₃-modified

Range shown is category-wide; refer to individual grade COA for precise specs.

1Products & Grades

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Alkaline Silica Sol (KOH or NH₃ Stabilized)

Alkaline silica sol stabilized with KOH (potassium hydroxide) or NH₃ (ammonia) is the dominant chemistry for industrial applications. The pH 9-11 alkaline range maintains particle stability over 12+ month storage. Used in investment casting, paper coating, and refractory binders.

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CMP-Grade Silica Sol for Wafer Polishing

Chemical-mechanical polishing (CMP) silica sol is ultra-high-purity colloidal silica used for semiconductor wafer surface planarization and photovoltaic silicon wafer polishing. Trace metal content typically below 1 ppm; particle size strictly controlled (D50 30-80 nm) for required surface roughness.