Silicone Resins (siblings)
Silicone Resin for LED Encapsulation
Methyl-phenyl silicone resins with refractive indices of 1.50–1.55 and high optical clarity are the standard encapsulant for high-power LED primary lenses and chip-on-board (COB) fills. Their combination of >92% transmittance at 450 nm, thermal stability to 150 °C, and UV resistance over 50,000 operating hours makes them irreplaceable for solid-state lighting.
Specifications
| Refractive Index | 1.40–1.55 (tunable via phenyl content) |
| Light Transmittance | >92% at 450 nm (blue LED) |
| Service Temperature | -40 °C to +150 °C |
| Hardness (Shore D) | 30–80D (lens grade typically 50–70D) |
| Yellowing Resistance | ΔYI <2 after 1,000 h UV at 60 °C |
Applications
- High-power LED primary lens (1W–100W chip packages)
- Chip-on-board (COB) fill for area-lighting modules
- Automotive headlamp LED encapsulant
- UV-LED and deep-UV LED encapsulation
- Mini-LED and Micro-LED display backlight encapsulant
Key Features
- Refractive index tunable 1.40–1.55 — optimizes light extraction efficiency
- Transmittance >92% at blue (450 nm) and white (550 nm) LED wavelengths
- ΔYI <2 after 1,000 h UV aging — critical for automotive exterior lighting
- Two-component addition-cure: fast cure at 100–150 °C, no by-products
- CTE matched to LED ceramic substrates and copper leadframes
Send Inquiry
Refractive Index
1.40–1.55 (tunable)
Transmittance
>92% @ 450 nm
Temp Range
-40 to +150 °C
Sample
Within 5 business days
Availability
In Stock